Cherrytech provides the very latest in PCB assembly and electronics manufacturing with facilities ranging from through-hole conventional assembly to the latest in surface mount µBGA, 0201 and fine pitch technology. Our fully trained colleagues work to the industry’s recognised standard of IPC-610 in a continuous improvement environment to provide quality assured products. 

We are experienced in building products for all markets and have the facilities to assemble PCBs from the proto-type stage through to volume production. 

To compliment our surface mount and leaded component assembly we inspect product using Automatic Optical Inspection and X-Ray equipment. 

 

SMT Assembly: 

Max Board size- 680 x 460mm 

Component Placement size to 0201  

BGA /uBGA 

LGA 

CSP 

Forced Convection Reflow  

ROHS compliant process 

Non – ROHS (Leaded process) offered on request. 

Proto-type assembly through to low and high volume assembly  

 

Conventional Assembly: 

Fully Automated Radial and Axial placement 

Wave Solder 

Hand Build. 

 

Inspection: 

Automatic Optical Inspection 

X-Ray 

 

Additional Capabilites: 

Conformal Coating 

Potting 

 

Testing:  

Functional Test 

Diagnostics